I have not been following this thread very closely, but did anyone bring up the
aapproach whereby devices are subjected to added stress; e.g., high temperature
"Burn In" aka "Accelerated Life Test" as part of a regime of establishing
reliability for a device.
In the microelectronics world, they uses MIL-STD-883. During the process of
"Qualification" the device is subjected to a variety of tests and environments
to demonstrate deisgn adaquacy. "1000 Hour Life Test" is a common part of
qualification and involves an extended burn-in for 1000 hours at 125 deg C
(typical). The hardware is tested every 250 hours or so.
I believe there is some information in the literature that equates Life Test
with MTBF... but I can't remember what it is.
There, I feel better now...
Steve (WG7K)
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