Guys,bon.'t try applying cooling lliquid against the flange: it is not dsigned
to withstand corrosion of any kind!
What you can do is glue the device on the heatsink using silverr loaded epoxy
from Elecolit or some equivalent.
We did dolfder devices to copper heatsinks
.but that requires special heating plates going up to about 240 degrees
centigrade, and some eutectic solder, not cheap. Don't try it with new devices.
נשלח מסמארטפון ה-Samsung Galaxsy שלי.
<div>-------- הודעה מקורית --------</div><div>מאת: John Lyles
<jtml@losalamos.com> </div><div>תאריך:26/08/2016 10:44 (GMT+02:00)
</div><div>אל: amps@contesting.com </div><div>עותק: </div><div>נושא: [Amps]
LDMOS HEAT SPREADERS </div><div>
</div>I wonder if a high power transistor could mount on a chill block sold
for puck type very high power devices. For instance,
http://catalog.chtechnology.com/viewitems/extruded-bonded-fin-heat-sinks/liquid-chill-block?&plpver=10&forward=1
Of course, getting the RF into and out off the device with this cooler
in the way is tricky.
John
K5PRO
> Date: Mon, 22 Aug 2016 07:44:16 +0100
> From: Steve Thompson <g8gsq72@gmail.com>
>
> With water cooling, why not sit the transistor over a pocket and
> run the coolant directly against the flange? That's a method I saw
> in production test at the Philips (as it was) factory.
>
> NEC had an ill fated TV broadcast tx which cooled the transistors
> with compressed air blown directly onto the flange. In terms of
> cooling I was told it worked just fine, the problem came when the
> nozzles blocked with dust.
>
> Steve
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