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1. [Amps] Using surface-mount devices (score: 1): Author: "Chris Bartram" <gw4dgu@blaenffos.org>; Date: Fri, 12 Sep 2003 21:23:45 +0100; Earning my bread-and-butter as an engineer designing RF electronics, I've spent far too much time working on SM PCBs..... If you have the right tools, it's not so difficult to work with SM discrete c; /archives//html/Amps/2003-09/msg00107.html (8,139 bytes)
2. Re: [Amps] Using surface-mount devices (score: 1): Author: "Dr. David Kirkby" <drkirkby@ntlworld.com>; Date: Sat, 13 Sep 2003 12:52:30 +0100; and professionally made. Perhaps you have better techniques than me Chris, but I would only ever get a board professionally made for those dimension. Gone are the days of laying out the board with ta; /archives//html/Amps/2003-09/msg00112.html (9,973 bytes)
3. Re: [Amps] Using surface-mount devices (score: 1): Author: peter.chadwick@zarlink.com; Date: Mon, 15 Sep 2003 10:43:37 +0200; They're nothing - just wait until you get WSP (Wafer Scale Packaging). In that, you take the IC chip and put a layer of insulation over the top, with via holes to the pads. Then you metalise through; /archives//html/Amps/2003-09/msg00127.html (7,757 bytes)
4. Re: [Amps] Using surface-mount devices (score: 1): Author: peter.chadwick@zarlink.com; Date: Mon, 15 Sep 2003 11:01:16 +0200; David said about RSGB Radcom down for being too technical. It's always been a bit of a problem with Radcom, and I guess, QST. Most hams these days aren't that interested in technical matters, while l; /archives//html/Amps/2003-09/msg00128.html (7,647 bytes)
5. Re: [Amps] Using surface-mount devices (score: 1): Author: "Dr. David Kirkby" <drkirkby@ntlworld.com>; Date: Wed, 17 Sep 2003 00:58:46 +0100; Yes, there is probably a lot of truth in that. That's probably not helped by the fact that one can gain an amateur license whilst learning next to nothing. I recall reading once (~15 years ago) in Ra; /archives//html/Amps/2003-09/msg00149.html (10,566 bytes)

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