To: | Dave Haupt <emailw8nf@yahoo.com> |
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Subject: | Re: [Amps] Re: Using Surface-Mount Devices |
From: | peter.chadwick@zarlink.com |
Date: | Tue, 16 Sep 2003 17:26:28 +0200 |
List-post: | <mailto:amps@contesting.com> |
Dave said >We've done a few solder-bumped WSPs, with 20mil >(0.5mm) center-to-center spacing on the pads. There >are rumours that industry is going to head towards >0.4mm and even 0.35mm, but they will reach a limit. We're using 10 mil (.25mm) spacing on a 40 'pin' WSP package. Not my choice, but there..... I'm beginning to think that moving to octal tube sockets was pushing it a bit far! 73 Peter G3RZP _______________________________________________ Amps mailing list Amps@contesting.com http://lists.contesting.com/mailman/listinfo/amps |
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