I was musing on this overnight - tin 'whiskers' with lead free
solder is an issue in where there's very fine line spacing on
component legs/pcbs. I think there's a different problem we'll
see, and probably more so in high power applications.
Tin/lead solder is soft and ductile. It absorbs a lot of
mechanical stress, especially thermal expansion/contraction stress
(which can be enormous, even at tiny movements). Lead free solder
is harder and appears not to adhere to metal as well. More stress
is going to be transferred into components. I suspect there will
be joint and component failures where there's thermal extremes or
cycling. I hope I'm proved wrong.
Steve
_______________________________________________
Amps mailing list
Amps@contesting.com
http://lists.contesting.com/mailman/listinfo/amps
|