ORIGINAL MESSAGE: (may be snipped)
On Thu, 12 Dec 2013 14:43:10 +0000, Manfred wrote:
>For that reason I use a radically different technique: I apply a single
>thick round blob of thermal compound to the middle of the mounting
>surface, or if the device is long, I apply a single nice smooth string
>of compound to it. Then I mount it, pressing it down strongly but
>evenly, to make the compound flow out and fill the whole space. In this
>way the formation of air pockets is avoided. When thermal compound
>appears squeezed out all around the device, I can be sure that no air
>remains anywhere under the part. From this point on, additional pressure
>can be used to thin out the layer of thermal compound. This pressure
>should be well distributed over the device, to avoid deforming it. Just
>tightening the mounting screws is not a good idea. A clamp in the middle
>of the device is ideal.
>
>If necessary, the device and heatsink can be warmed up to soften the
>thermal compound and make it flow out more easily. Otherwise it's a good
>idea to re-tighten the mounting screws during the first test run, when
>the equipment and specially the power devices get warm.
>
>Since I'm a hopeless cheapskate, I scoop up the excess thermal compound
>that squeezes out, and use it for the next device.
>
>This method has worked well for me, in 35 years building electronic
>equipment, and is easy and quick.
>
>Manfred
REPLY:
Excellent idea. Will definitely use it. Thanks!!
73, Bill W6WRT
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