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Re: [Amps] Amps Digest, Vol 169, Issue 10

To: "amps@contesting.com" <amps@contesting.com>
Subject: Re: [Amps] Amps Digest, Vol 169, Issue 10
From: "Scott, Christopher" <chris.scott@wku.edu>
Date: Tue, 3 Jan 2017 15:24:06 +0000
List-post: <amps@contesting.com">mailto:amps@contesting.com>
It's not so much the initial soldering, but future device replacement becomes 
much more difficult once the large heat spreader is mated to the PC board.

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Subject: Re: [Amps] FET cases / heat sink

Soldering an LDMOS FET onto/into a copper spreader is not difficult.

W6PQL has a video of the process on his site. A heating plate is used to
bring the copper spreader up to temperature.

Once soldered there is no requirement to re-tighten mounting hardware
after so many hours of operation nor is there the possibility of
snapping a screw off in the spreader or God forbid cracking the device
with too much torque.
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