Roger (sub1) wrote:
>On 8/25/2011 2:53 AM, Ian White GM3SEK wrote:
><snip>
>>
>> Another observation: if you have ever disassembled a CPU from its
>> heatsink, another thing to note is that the film of heat transfer
>> compound is extremely thin. The problem for manual application is to
>> replicate this, which usually means smearing on the compound and then
>> wiping almost all of it away.
>
>We don't follow that technique. We start with a blob of the transfer
>compound in the *center* of the heat sink. With spring tension applied
>the heat sink is rotated back and fourth "with in tolerances" until the
>compound comes out the edges. the excess is wiped off and the
>rotation is again applied. This gets down until the film of compound is
>probably no more than a few molecules thick. AT this point it is
>*almost* impossible to even pull the heat sink off the device with out
>rotating it to break the seal. There is very little sealant left in
>the interface between the device and cooler and it becomes very
>efficient at transferring heat.
>>
Thanks, Roger - I learned a little more today.
--
73 from Ian GM3SEK
http://www.ifwtech.co.uk/g3sek
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