[Amps] Re: Using Surface-Mount Devices

[peter.chadwick at Zarlink.Com]

Dave said

>We've done a few solder-bumped WSPs, with 20mil
>(0.5mm) center-to-center spacing on the pads.  There
>are rumours that industry is going to head towards
>0.4mm and even 0.35mm, but they will reach a limit.

We're using 10 mil (.25mm) spacing on a 40 'pin' WSP package. Not my
choice, but there.....

I'm beginning to think that moving to octal tube sockets was pushing it a
bit far!

73

Peter G3RZP