[Amps] Liquid cooling

[Ian White GM3SEK]

Roger (sub1) wrote:
>On 8/25/2011 2:53 AM, Ian White GM3SEK wrote:
><snip>
>>
>> Another observation: if you have ever disassembled a CPU from its
>> heatsink, another thing to note is that the film of heat transfer
>> compound is extremely thin. The problem for manual application is to
>> replicate this, which usually means smearing on the compound and then
>> wiping almost all of it away.
>
>We don't follow that technique.  We start with a blob of the transfer 
>compound in the *center* of the heat sink. With spring tension applied 
>the heat sink is rotated back and fourth "with in tolerances" until the 
>compound comes out the edges.   the excess is wiped off and the 
>rotation is again applied. This gets down until the film of compound is 
>probably no more than a few molecules thick. AT this point it is 
>*almost* impossible to even pull the heat sink off the device with out 
>rotating it to break the seal.  There is very little sealant left in 
>the interface between the device and cooler and it becomes very 
>efficient at transferring heat.
>>

Thanks, Roger - I learned a little more today.


-- 

73 from Ian GM3SEK
http://www.ifwtech.co.uk/g3sek