On Sep 22, 2004, at 1:03 AM, peter.chadwick@Zarlink.Com wrote:
G8WRB said:
the rate of metal migration would decrease
exponentially with increasing thickness
There is a limit to how thick you can deposit metal. The Unitrode
process,
which uses the end of the lead in direct contact has some advantages
here.
At least in diodes, you don't tend to get the step coverage problem
that
you get in ICs. However, metal migration is also a temperature related
phenomena, so depending on the diode construction, and the temperature
and
the operating time, it might or might not be a problem.
Operating in avalanche mode is not desirable for a semiconductor
junction
that hasn't been designed to so do,
As I see it, with good engineering practice, rectifiers are not
operated anywhere near their avalanche Vr.
...
...
Richard L. Measures, AG6K, 805.386.3734. www.somis.org
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