I know that Manfred and others on this list have advanced thermodynamics
knowledge - and hope to explore a curiosity of mine regarding high power
amplifiers with the current 48 volt big fets.
There is prevalent thought that unless one can significantly derate device
power handling, bolted device to copper heat spreader connections are quite
inferior - soldering is best. The device case to copper connection seems the
weakest link.
Why don't the manufacturers add another $3.00 worth of copper to the case size
(and mass) to better spread the heat over more area (and slow the thermal time
constant)?
Wouldn't this greatly improve the functioning? Wouldn't bolted mounting then
work better?
Chris Scott
W4NEQ
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