[Amps] Amps Digest, Vol 169, Issue 10
Scott, Christopher
chris.scott at wku.edu
Tue Jan 3 10:24:06 EST 2017
It's not so much the initial soldering, but future device replacement becomes much more difficult once the large heat spreader is mated to the PC board.
---------------------------------------------------------------------
Subject: Re: [Amps] FET cases / heat sink
Soldering an LDMOS FET onto/into a copper spreader is not difficult.
W6PQL has a video of the process on his site. A heating plate is used to
bring the copper spreader up to temperature.
Once soldered there is no requirement to re-tighten mounting hardware
after so many hours of operation nor is there the possibility of
snapping a screw off in the spreader or God forbid cracking the device
with too much torque.
________________________________________
More information about the Amps
mailing list