[Amps] Amps Digest, Vol 169, Issue 10

Scott, Christopher chris.scott at wku.edu
Tue Jan 3 10:24:06 EST 2017


It's not so much the initial soldering, but future device replacement becomes much more difficult once the large heat spreader is mated to the PC board.

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Subject: Re: [Amps] FET cases / heat sink

Soldering an LDMOS FET onto/into a copper spreader is not difficult.

W6PQL has a video of the process on his site. A heating plate is used to
bring the copper spreader up to temperature.

Once soldered there is no requirement to re-tighten mounting hardware
after so many hours of operation nor is there the possibility of
snapping a screw off in the spreader or God forbid cracking the device
with too much torque.
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