[Amps] Amps Digest, Vol 169, Issue 10

[Richard Solomon]

One idea was to use a lower Temp
Solder for the device than the rest
of the components.

Indium Solder ??

73, Dick, W1KSZ

On Tue, Jan 3, 2017 at 8:24 AM, Scott, Christopher <chris.scott at wku.edu>
wrote:

> It's not so much the initial soldering, but future device replacement
> becomes much more difficult once the large heat spreader is mated to the PC
> board.
>
> ---------------------------------------------------------------------
> Subject: Re: [Amps] FET cases / heat sink
>
> Soldering an LDMOS FET onto/into a copper spreader is not difficult.
>
> W6PQL has a video of the process on his site. A heating plate is used to
> bring the copper spreader up to temperature.
>
> Once soldered there is no requirement to re-tighten mounting hardware
> after so many hours of operation nor is there the possibility of
> snapping a screw off in the spreader or God forbid cracking the device
> with too much torque.
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