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Re: [TenTec] Omni VI audio problem

To: "'Discussion of Ten-Tec Equipment'" <tentec@contesting.com>
Subject: Re: [TenTec] Omni VI audio problem
From: "Paul Christensen" <w9ac@arrl.net>
Reply-to: Discussion of Ten-Tec Equipment <tentec@contesting.com>
Date: Wed, 19 Sep 2018 06:59:02 -0400
List-post: <mailto:tentec@contesting.com>
Here's a thorough explanation of the audio connector bonding problem from K9YC:

http://www.audiosystemsgroup.com/Pin_1_Revisited.pdf

The problem is ripe when circuit board sub-assemblies are used as a direct 
interface to the outside world.  It's especially problematic when using an 
extruded aluminum chassis.  Typically, a circuit board with audio connectors 
slides into the retaining fins of the chassis.  But, there's no cost-effective 
nor practical means to bond the connector to the chassis end-plates with a 
bonding jumper after assembly.  Many manufacturers ignore the potential for 
hum/buzz, and settle for convenience and cost-effective assembly over noise 
performance as discussed in K9YC's article.  

Paul, W9AC

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